Precision electronics, custom PCB schematics, and low-latency RTOS firmware.
Circuit concepts, PCB direction, embedded systems, IoT devices, sensors, controllers, gateways, prototype validation, and connected hardware planned with the product experience.
Hardware IP
Schematics & Gerbers
Prototypes
HIL Tested & Verified
Firmware
C/C++ & RTOS Native
Production
DFM & Supplier Ready
Multi-layer high-speed printed circuit board layout, impedance control, power distribution networks, and signal integrity optimization.
Firmware development for modern microcontrollers and ARM processors using real-time operating systems and low-latency embedded code.
Connected sensor nodes, edge gateways, and industrial telemetry modules utilizing wireless protocols, cellular IoT, and fieldbuses.
Battery management systems (BMS), energy harvesting circuitry, ultra-low-power sleep modes, and high-efficiency power converter designs.
Automated test benches and thermal chamber validation simulating harsh real-world operating conditions before mass production release.
Design-for-Manufacturability (DFM) packaging, Bill-of-Materials (BOM) sourcing risk audits, and assembly vendor coordination.
This discipline is engineered as part of a modular, reusable architecture supporting high-concurrency scaling, hardware precision, and long-term global platform ownership.
Connected industrial sensor nodes, multi-channel analog inputs, and micro-power environmental probes engineered for harsh conditions.
High-speed multi-layer printed circuit boards, impedance-controlled trace routing, power distribution networks, and signal integrity.
Firmware development on modern ARM processors, microcontrollers, and wireless silicon running real-time operating systems.
Automated electronic test benches, signal validation analyzers, thermal stress chambers, and DFM manufacturing handoff.
01
Audit operational environment, sensor requirements, microcontroller constraints, and component sourcing risks.
02
Design multi-layer high-speed PCB layouts, impedance-controlled trace routing, and power distribution networks.
03
Develop low-latency embedded firmware and assemble initial physical board prototypes.
04
Validate electronic performance against automated test benches, thermal chambers, and environmental stress suites.
05
Deliver complete Gerber files, manufacturing BOMs, enclosure CAD mating specs, and assembly vendor packages.
Complete Gerber files, drill plots, layer stackups, and schematic CAD files.
Manufacturing Bill of Materials (BOM) with dual-source component sourcing.
Embedded C/C++ firmware repositories with peripheral driver libraries.
Hardware test protocols, calibration procedures, and HIL validation logs.
Enclosure mechanical mating files and thermal dissipation analysis.
FCC/CE pre-compliance testing documentation and safety guidelines.
Direct answers about hardware engineering solutions, delivery, and next steps.
Yes. Techbrain Networks combines software development, hardware engineering, SolidWorks 3D CAD design, applied R&D, and digital marketing into a single unified product delivery roadmap.
The client owns 100% of all intellectual property, source code repositories, PCB schematics, Gerber files, 3D STEP CAD models, and technical documentation produced.
Engagements begin with a technical discovery workshop to review system requirements, physical constraints, software stack, delivery timeline, and provide a fixed-scope architecture blueprint.
Share your requirement once and we will use it to understand the technical scope, timeline, and ideal next step.
Primary Email
contact@techbrainnetworks.comProject Scope
Share the industry, product goal, users, timeline, existing systems, and the outcome you want to improve.
Operating Regions
Project conversations can be coordinated across India and Canada.